Job Title: Senior Power Module Process Engineer

Job Summary

Our client is seeking an experienced Senior Power Module Process Engineer to support the development and manufacturing of advanced semiconductor power-module products. The successful candidate will lead process characterization, establish critical manufacturing controls, and collaborate with cross-functional engineering teams to improve product quality, reliability, cost, and production performance.

Key Responsibilities

• Conduct Design of Experiments (DOE) and process characterization for critical power-module manufacturing processes.
• Define process materials, operating parameters, tooling controls, and handling procedures.
• Develop and maintain process-design guidelines, control plans, and manufacturing specifications.
• Work closely with Process Engineering, Equipment Engineering, Quality, Product Management, and other technical teams.
• Troubleshoot complex manufacturing and product-quality issues.
• Analyse engineering and production data using statistical methods.
• Support process optimization, yield improvement, reliability improvement, and defect-reduction initiatives.
• Participate in cost-reduction projects related to power-module products.
• Prepare technical reports and communicate findings to internal stakeholders.

Qualifications and Experience

• Bachelor's degree or higher in Electronics, Electrical Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering, Industrial Engineering, or a related field.
• At least five years of relevant experience in semiconductor assembly, power modules, wafer-level packaging, IC packaging, or electronic-module manufacturing.
• Practical experience in product or process development, material selection, assembly, or package reliability.
• Strong knowledge of engineering data analysis, SPC, DOE, APQP, and FMEA.
• Candidates must have detailed practical knowledge of at least two or three of the following processes:
• Advanced SMT, including high-density, multilayer, or double-sided component assembly.
• Silver or copper sintering, including pressure and pressureless sintering.
• Soft-solder die attach.
• Aluminium or aluminium-copper wedge and ribbon bonding.
• Vacuum or formic-acid reflow.
• Advanced flip-chip processes, including multi-die, stacked-die, fine-pitch flip chip, and thermo-compression bonding.
• Capillary underfill for fine-pitch flip-chip or thermo-compression bonding applications.
• Advanced copper-clip processes, including exposed copper clips.
• Heat-sink or heat-slug attachment.
• Advanced moulding, including double-sided moulding, low-wire-sweep moulding, liquid moulding, and compression moulding.
• Low-stress blade or laser-singulation processes.

Key Copetencies

• Strong analytical and structured problem-solving skills.
• High level of responsibility and attention to detail.
• Quality-focused mindset with a strong commitment to zero-defect manufacturing.
• Effective cross-functional communication and coordination skills.
• Good command of English.