About the Role

Evantis Talent Solutions is recruiting on behalf of a global leader in semiconductor assembly and advanced packaging equipment. This is an opportunity to join a highly technical team at the forefront of die bonding and advanced packaging technology, working directly with customers across the APAC region.

As an Application Engineer, you will develop and optimise die bonding processes, run customer sample evaluations in the demo room, and provide hands-on application support both remotely and on-site at customer facilities.

Key Responsibilities

• Develop die bonding processes and conduct customer sample evaluations in the demo room
• Prepare presentations and application reports for customers and internal stakeholders
• Deliver process training, application support, and optimisation of die bonding and advanced packaging processes — remotely or at customer sites across APAC
• Support internal teams and distributors on process-related topics
• Take ownership of the demo machine pool and associated facilities
• Travel across the APAC region as required

Requirements

• Bachelor's Degree in Engineering (Master's Degree preferred)
• Minimum 5 years of relevant experience
• Hands-on experience with assembly equipment (SMD Mounter, Die Bonder) — required
• Proven experience developing die bonding processes, ideally within an NPI (New Product Introduction) department of an OSAT facility, across a broad variety of product types rather than a single product line
• Working knowledge of CAD software (SolidWorks basics)
• Proficiency in Microsoft Office
• Strong English communication skills, written and spoken
• Willingness and ability to travel frequently across APAC