About the Role

Our client, a global supplier of high-precision die bonding and micro-assembly equipment, is expanding its APAC team in Thailand to grow its presence in the semiconductor and advanced packaging equipment market. They are looking for a Sales Engineer to lead technical sales activities across Thailand and the broader APAC region.

This is a customer-facing, consultative sales role suited to a technically credible engineer with commercial drive and a genuine interest in high-precision technology.

Key Responsibilities

• Drive sales of semiconductor and advanced packaging equipment to customers across Thailand and APAC
• Conduct customer visits, develop new opportunities, and manage the end-to-end sales cycle
• Coordinate with distributors and channel partners
• Lead technical discussions with engineering and procurement stakeholders at customer sites
• Prepare quotations, proposals, and commercial documentation
• Support marketing and business development activities, including trade shows and industry events
• Provide regional market feedback to headquarters and contribute to APAC strategy

What We're Looking For

• Proven experience in technical sales, ideally within semiconductor equipment, SMT, automation, precision engineering, photonics, or related high-tech industries
• Strong technical foundation, with an engineering degree or equivalent experience
• Comfortable engaging both technical and commercial decision-makers
• Self-motivated, with strong opportunity development and account management instincts
• Good English communication skills, both written and spoken
• Willingness to travel within Thailand and APAC as needed
• Must be eligible to work in Thailand

Compensation

• Base salary: Competitive Base + Commission scheme

What's On Offer

• 16 days annual leave
• Performance bonus
• Group health insurance
• Travel allowance

Logistics

• Pathum Thani
• A private car is preferred due to the office location
• Full-time, permanent role

About the Company

Our client is a global supplier of high-precision die bonding and micro-assembly equipment, supporting semiconductor, photonics, and advanced packaging applications for over 30 years. Their platforms support customers from feasibility and prototyping through to high-yield production across applications such as optical transceivers, LiDAR modules, power devices, MEMS, RF components, and quantum hardware.