Senior Process Engineer - Semiconductor Assembly & Packaging

Location: Bangkok

Employment Type: Permanent

Experience: 5-7 years

Salary: Open, depending on experience

Relocation: Expatriate candidates welcome, with relocation support

About the Role

Our client, a leading global semiconductor assembly and testing company, is seeking a Senior Process Engineer to lead technical projects across semiconductor assembly and advanced packaging processes.

The position will focus on improving manufacturing yield, quality, equipment efficiency and cost. Relevant technologies include Power QFN, Cu Clip, SiP, die attach, flip chip, wire bonding and molding.

The successful candidate will combine strong hands-on process knowledge with project leadership, customer communication and the ability to mentor junior engineers.

Responsibilities

• Lead engineering projects focused on yield improvement, equipment efficiency, quality and cost reduction.
• Maintain and improve semiconductor assembly and packaging processes.
• Support technologies including Power QFN, Cu Clip, SiP, die attach, flip chip, wire bonding and molding.
• Troubleshoot process abnormalities, equipment issues and product defects.
• Conduct root-cause analysis and implement corrective and preventive actions.
• Apply DOE, SPC, FMEA, 8D and other process-control methodologies.
• Optimize equipment settings, process parameters, materials and production methods.
• Support new product introduction, process qualification, engineering builds and mass-production ramp-up.
• Monitor process capability, yield, quality, productivity and cycle time.
• Lead technical investigations into customer complaints and production issues.
• Act as a technical interface with customers and present engineering solutions.
• Mentor junior engineers and provide technical guidance during project execution.
• Coordinate with Production, Equipment, Quality, Product Engineering, R&D and customer teams.
• Prepare process specifications, control plans, work instructions and engineering reports.
• Implement engineering best practices and manufacturing standards.

Requirements

• Bachelor's or Master's degree in Electronics, Electrical, Mechanical, Materials, Mechatronics, Industrial Engineering or a related field.
• Approximately 5-7 years of experience in semiconductor assembly, advanced packaging or OSAT manufacturing.
• Strong hands-on experience in one or more of the following:
• • Power QFN or Cu Clip
  • PMOS or MOSFET packaging
  • SiP or System-in-Package
  • Flip chip
  • Wire bonding
  • Molding
• Direct Cu Clip or Power QFN experience would be highly advantageous.
• Strong process troubleshooting, defect analysis and root-cause analysis skills.
• Demonstrated experience improving yield, quality, productivity or manufacturing cost.
• Working knowledge of DOE, SPC, FMEA, 8D and process-control methodologies.
• Six Sigma Green Belt certification is preferred.
• Able to lead engineering projects and mentor junior engineers.
• Strong customer communication and technical presentation skills.
• Working English is required for expatriate candidates.
• Open to candidates requiring relocation to Thailand.