Section Manager - Process Engineering

Location: Bangkok

Employment Type: Permanent

Experience: 7-10 years

Salary: Open, depending on experience

Relocation: Expatriate candidates welcome, with relocation support

About the Role

Our client is seeking a Section Manager to lead a team of engineers responsible for semiconductor assembly and advanced packaging processes.

The position will oversee engineering performance, technical projects, process improvement and team development. The successful candidate will have strong semiconductor process knowledge, proven people-management experience and the ability to deliver engineering projects across multiple stakeholders.

Relevant technologies include Power QFN, Cu Clip, SiP, flip chip, wire bonding and molding.

Responsibilities

• Lead, supervise and develop a team of process and manufacturing engineers.
• Set team priorities and ensure alignment with production, quality and business objectives.
• Oversee semiconductor assembly and advanced-packaging engineering activities.
• Manage engineering projects covering yield improvement, quality, capacity, equipment efficiency and cost reduction.
• Plan project scope, resources, schedules and budgets.
• Drive process improvement across Power QFN, Cu Clip, SiP, flip chip, wire bonding and molding operations.
• Implement FMEA, SPC, control charts, DOE, 8D and other advanced quality tools.
• Review process performance, engineering data, yield losses and production abnormalities.
• Ensure effective root-cause analysis and implementation of corrective and preventive actions.
• Support new product introduction, process qualification, technology transfer and mass-production ramp-up.
• Collaborate with Production, Quality, Equipment, Product Engineering, R&D and commercial teams.
• Ensure processes meet customer, automotive, quality and regulatory requirements.
• Act as a senior technical interface for customers and overseas stakeholders.
• Coach engineers, conduct performance reviews and develop succession and technical-training plans.
• Promote engineering standards, continuous improvement and knowledge sharing.
• Ensure projects are delivered within agreed scope, schedule and budget.

Requirements

• Bachelor's or Master's degree in Engineering or a related technical discipline.
• Approximately 7-10 years of semiconductor assembly, packaging or OSAT experience.
• Previous experience leading engineers, supervisors or technical project teams.
• Advanced knowledge of several of the following:
• • Power QFN and Cu Clip
  • PMOS or MOSFET packaging
  • SiP or System-in-Package
  • Flip chip
  • Wire bonding
  • Molding and encapsulation
• Direct experience in Cu Clip, Power QFN or power-semiconductor packaging would be highly advantageous.
• Proven record of improving manufacturing yield, quality, productivity or cost.
• Strong knowledge of FMEA, SPC, DOE, 8D and control-chart methodologies.
• Experience managing engineering projects involving multiple functions and stakeholders.
• Strong leadership, coaching and performance-management skills.
• Knowledge of automotive semiconductor quality requirements would be advantageous.
• PMP certification or equivalent project-management training is preferred.
• Strong communication and technical presentation skills.
• Working English is required for expatriate candidates.
• Open to candidates requiring relocation to Thailand.